Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...

Introducing New Solutions to Address Emerging Assembly Challenges. SINGAPORE, March 24, 2026 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. ("K&S", "Company") today announced ...

Together with a broad portfolio of K&S solutions, ASTERION™-TW will debut at the SEMICON China Trade Show – Hall N3, Booth #3431 – in Shanghai, from March 25, 2026 through March 27, 2026. Please ...